Market Overview

The 3D Integrated Circuit Market is expected to grow significantly at a CAGR of 17% and is estimated to reach up to USD 10,470 Million during the forecast period.

The trend for 3D Integrated Circuit Market is being fueled by advancements in the microelectronics and semiconductor industries. It aids in the enhancement of performance and functionality. It also aids in reducing power usage following the requirements of electronic gadgets. Gadgets such as tablets, smartphones, computers, and other electronic devices use 3D integrated circuits. This extends the battery's life and saves a lot of space. Cores, sensors, analog RF circuits, and other components make up each IC stack.

The coronavirus outbreak has a negative influence on the market for 3D integrated circuits. The highly contagious sickness wreaked havoc all around the globe. Due to the virus's rapid spread, millions of people died all across the world in a short period. Several governments around the world have imposed a state of emergency to stem the spread. This measure has a significant impact on businesses and manufacturing units. During this time, they suffered significant financial losses. It also resulted in a labor shortage and a disruption in the supply chain. However, as people's knowledge grows and healthcare infrastructure improves, the 3D IC industry will soon resume its upward trend.

Top Market Contenders

The well-known market contenders in the global 3D IC are mentioned as Tezzaron Semiconductor Corporation, and BeSang Inc., Xilinx Inc., United Microelectronics Corporation, Monolithic 3D Inc., Intel Corporation, 3M Company, and, IBM Corporation.

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With the mounting demand for miniaturization of consumer electronics and communication technology, a 3D IC is being considered as a model solution as it enables the development of high performing microchips with the low-power consumption capability and small form factor. Therefore, transmission, high-speed data processing, enhanced storage capacity, smart and connected devices, and high brightness lighting are some of the critical requirements of modern electronic devices that are considering to be vital motivating factors behind the growth of the 3D IC market.

On the same note, the development of high-performance networking devices with large storage capacity needs enormous bandwidth. Thus, to manage the bandwidth and memory challenges, companies are adopting 3D IC technology owing to its chip density and high bandwidth benefits. This is yet again an influential factor leading the market to earn more and more valuation in the future. Additionally, the high proliferation of the Internet of Things (IoT) devices and smart connected products, various manufacturers in the 3D IC market are designing and manufacturing the ICs to employ various applications such as Micro-Electro-Mechanical Systems (MEMS). The purpose stays to streamline the processes, improve productivity, and reduce chances of sudden failure and prevent downtime. The use of sensors in devices and machines are influencing manufacturers in the 3D IC market to bring more new products, which is also motivating the market to a great extent. 

Segmentation of Market: 3D IC

From the viewpoint of segmental analysis, the global 3D IC market is studied among various technology, components, products, and applications.

Segmentation by Technology includes the type (3D stacked ICs and monolithic 3D ICs) and packaging integration (3D system-in-package (Sip), 2.5D 3D interposing, 3D wafer-level packaging (WLP), and 3D heterogeneous integration.

Segmentation by Components included through glass vias (TGVs), through-silicon vias (TSVs), and others.

Segmentation by Products has included 3D memory, CMOS image sensors (CIS), MEMS sensors, and light-emitting diodes.

Segmentation by Application has included consumer electronics, IT/telecommunication, aerospace defense, industrial, automotive, medical, and others.

Regional Outlook

From the viewpoint of the region, the global commercial telematics market study is conducted among crucial regions such as North America, Europe, Asia Pacific, and the rest of the world.

Asia-Pacific is leading the global 3D IC market with the largest market share owing to promising demand from the growing consumer electronics market in the region. This is expected to expand with the highest revenue by the year 2022. 

Whereas, North America region will also expand as the second-highest market after Asia-Pacific in the forecast period owing to the rising demand for ICs in the U.S. and Canada region.

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